2D Chemical StructureDatabase ID 87398
No renderable structure data available
SMILES
CCO[Si](C)(OCC)O[Si](C)(OCC)OCCStructure data verified · Database ID 87398
Chemical Intermediate
[diethoxy(methyl)silyl]oxy-diethoxy-methylsilane
CAS 18001-60-0Product ID 271298
| Intermediates | [diethoxy(methyl)silyl]oxy-diethoxy-methylsilane |
|---|---|
| IUPAC Name | — |
| CAS Number | 18001-60-0 |
| Database ID | 87398 |
| Molecular Formula | — |
| Molecular Weight | — |
Product Information
[diethoxy(methyl)silyl]oxy-diethoxy-methylsilane
[diethoxy(methyl)silyl]oxy-diethoxy-methylsilane (CAS 18001-60-0) product identity, structure identifiers and related reaction data for chemical intermediate research and sourcing review.
CAS Number18001-60-0
Database ID87398
Molecular Formula—
Updated2023-01-08
Potential Applications
Potential Applications
For professional research and industrial use only
Database ID 87398
Computed Properties
Exact Mass—
XLogP—
Topological Polar Surface Area—
Hydrogen Bond Donors—
Hydrogen Bond Acceptors—
Rotatable Bonds—
- IUPAC Name
- —
- InChIKey
- —
- SMILES
- CCO[Si](C)(OCC)O[Si](C)(OCC)OCC
- InChI
- —
Safety Notice
Safety & Notes
For professional research and industrial use only. Review the supplier safety data sheet before handling.
PubChem References
Public References
These sources are listed in the compound's public database record.
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CAS 18001-60-0[diethoxy(methyl)silyl]oxy-diethoxy-methylsilane
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